One component epoxy structural adhesive 919
Luxbond 919 is a low halogen epoxy based liquid filler material, which is used for the assembly of CSP, BGA and ubga. This kind of filling material has the advantages of rapid curing at low temperature, similar reliability to the connection with thermosetting resin, and excellent maintainability. The cured filler material can be removed at any time if necessary, the product is easy to distribute and can quickly pass through a gap of 15 microns, for example. It is used for the assembly of CSP, BGA and ubga. The filler material allows repair of tested defective connections to improve the yield of the assembly process. This product is used in electronic products that are easy to be impacted, such as portable phones, laptops, etc., to improve the assembly reliability of CSP and BGA.
